Burn-in socket for gull wing integrated circuit package

摘要

Four embodiments of a burn-in socket for gull wing configured semiconductor packages are disclosed where each of the embodiments includes latching means which a mechanical advantage assisting in the installation of the carrier and package. Two of the embodiments include four centered posts which include helical ramparts which contact directly on the upper surface of the carrier. A third embodiment is disclosed which includes a lid which rotates over the upper face of the carrier, where the cover includes a post having a helical rampart where the helical rampart contacts a shoulder of the socket which lowers the cover. The fourth embodiment discloses two overlapping doors where the outer door contacts the inner door thereby closing the inner door moving the carrier downward.