发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 <p>PURPOSE:To prevent static electricity from a human organism and abnormal voltage from an external part from being impressed between respective electrode terminals while a cartridge is operated or carried with by bending the tip part of the terminal in the groove formed on the edge surface of a sealing resin near the tip part of the electrode terminal and preventing the tip part from projecting from the edge surface of the sealing resin. CONSTITUTION:An IC chip 15 is mounted on a die pad 11 of a lead frame 10, and after a lead 12 is connected with a wire 16, by using, for example, a die, a device is covered with a sealing resin 19 except one main surface 17 and one part of a tip part 14 of an electrode terminal 13 and an outer circumferential part 18 of the lead frame 10. At this time, the one main surface 17 of the electrode terminal is made into a form to be dropped into the recessed part of the sealing resin 19, a sealing resin edge surface 21 at the bending position of the tip part 14 is moved back for the thickness of the tip part 14 or more, and a groove 20 is formed into the width of which is equal to or a little wider than that of the tip part 14. Continuously, the lead frame 10 is cut by using, for example, the die, so that the lead frame 10 can be approximately flattened with the sealing resin edge surface 21, the tip part 14 of the electrode terminal is bent to a groove 20 side, and the one main surface 17, the tip part 14, and the electrode edge surface 22 of the electrode terminal 13 are prevented from projecting from the surface of the sealing resin 19.</p>
申请公布号 JPH01106392(A) 申请公布日期 1989.04.24
申请号 JP19870263437 申请日期 1987.10.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KURODA HIROSHI;KIKUCHI TATSUO;UENISHI MITSUAKI
分类号 G11C5/00;H01L23/28;H01L23/50 主分类号 G11C5/00
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