| 摘要 |
<p>PURPOSE:To prevent the peeling of an electrode terminal and a die pad exposed to the outside to external force and thermal strain by coating the electrode terminal in a lead frame and the outer circumferential section of one main surface of the die pad with a sealing resin. CONSTITUTION:An IC chip 13 is mounted onto the other main surface 12 of a die pad 11, pads for the IC chip 13 and the other main surfaces 12 of electrode terminals 14 are connected by wires 15, and the electrode terminals 14 and the outer circumferential section 17 of one main surface (an external exposed surface) of the die pad 11 are formed with a sealing resin 18 to a shape that the electrode terminals 14 and the outer circumferential section 17 are coated through a transfer molding method. It is preferable that the thickness of the sealing resin 18 coating the outer circumferential section 17 is brought to 0.1mm or less at that time. Reinforcing bars 19 are cut along the end face of the sealing resin 18 by using a mold, thus manufacturing discrete semiconductor integrated circuit device. Accordingly, the electrode terminals 14 exposed to the outside have structure in which they extremely resist peeling against external force.</p> |
