| 摘要 |
PURPOSE:To allow a conducting part between the top and bottom surfaces to be formed in a ceramic substrate with high accuracy and efficiency by projecting a laser beam onto the ceramic substrate and dipping a ultrasonic wave solder cell. CONSTITUTION:A throughhole 11 is formed by projecting a laser beam onto a baked ceramic substrate 5, the ceramic being reduced, and as a result a constituent metal 12 of the reduced ceramic is precipitated on the inner wall of such throughhole. After this, a solder 13 is loaded only in the throughhole where the metal 12 has been precipitated by dipping the ceramic substrate 5 into a ultrasonic wave solder cell, and a desired conducting part between the top and bottom surfaces is formed. In this case, since loading of the solder is made by dipping the ceramic substrate 6 into the ultrasonic wave solder cell, even a small throughhole allows the solder 13 to be selectively loaded within such throughhole. According to the constitution, it is ensured that small-diameter conducting parts can be formed with high efficiency and accuracy. |
