| 摘要 |
PURPOSE:To obtain the title molding isotropically exhibiting high rigidity and excellent heat resistance, comprising an amide bond-containing diacetylene polymer of a specified formula. CONSTITUTION:A molding of a diacetylene group-containing polyamide of formula I (wherein Y1 and Y2 are each a 1-12C monovalent organic group, a halogen or H, Z is a 1-24C bivalent organic group, and n>=2). This polymer can be produced from a diacetylene group-containing dicarboxylic acid derivative of formula II (wherein X is a halogen or OH and Y1 and Y2 are as defined above)) and a diamine compound of formula III (wherein Z is as defined above) by, e.g., a low-temperature solution polycondensation process or an interfacial solution polycondensation process. This molding is a high-rigidity molding densely crosslinked by crosslinking the diacetylene groups and excellent in thermal properties, and especially when a desirable molding process is adopted, the obtained molding can exhibit a modulus >=6 GPa and therefore is useful as a structural material. Because this molding can be easily subjected to, if necessary, heat treatment or machining such as cutting or cutting-off and can be processed into any desired shape, it is useful as a material for precision machine parts such as gears and cams and parts requiring excellent properties, such as electronic materials. |
