| 摘要 |
The present invention relates to an LED lamp using a gold-plated thermal-conductive chip having a via hole (240) formed between a lower copper foil surface (230) and an LED element thermal terminal (19) bonded copper foil surface (222) of a PCB assembly (50) upper copper foil surface (220) with which each LED element thermal terminal (19) mounted on the a PCB assembly (50) upper copper foil surface (220) of an LED lamp comes in contact. A copper (Cu) film (250) is formed on the internal diameter, and a gold-plated thermal-conductive chip (300), which has a silver (Ag) core coated with a gold (Au) film, is inserted into the copper film (250) by using a pressurizing press. By inserting a gold-plated thermal-conductive chip (300) between the upper copper foil surface and the lower copper foil surface of the PCB assembly (50) and utilizing the chip as a heat transfer means, high heat generated in the LED element can be rapidly radiated. |
