发明名称 BUS SUPPORTING DEVICE FOR SWITCHBOARD
摘要 PURPOSE:To make a switchboard by a sealed structure and compact the structure of a bus chamber, by a method wherein a bus support is made of ceramics insulator while the heating section of a heat pipe is embedded into the bus support and the heat radiating section of the heat pipe is pvovided outside of the switchboard. CONSTITUTION:A bus support 2, made of ceramics, is mounted on a frame 3 and a heat pipe 6 is embedded into the support 2. Heat, generated in a bus 1, is transferred to a 3-phase integrated ceramics-made bus support 2, attached closely, and, further, is transferred to the heating section 6a of a heat pipe 6, embedded into the support 2. Then, the heat is radiated to the outside of the title device from the radiating fins 6b of the heat pipe at the outside of the ceiling of the switchboard by the heat transfer effect of the heat pipe.
申请公布号 JPH0197108(A) 申请公布日期 1989.04.14
申请号 JP19870252996 申请日期 1987.10.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISHIKAWA MASAHIRO
分类号 H02B1/56;H02B1/20;H02G5/10 主分类号 H02B1/56
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