| 摘要 |
PURPOSE:To prevent oxidation of bonding area and to realize stable bonding by forming a flow path of a pressure plate with a primary groove which encloses the upper surrounding side of a window and a plurality of secondary grooves which are formed along the window circumferencially tilting downward from the primary groove and opened to the lower surrounding side of the window. CONSTITUTION:A primary grove 12 is formed at a step 11c of the body 11a of a pressure plate 11 enclosing surrounding side of a recess 11d in one-piece construction. A plurality of secondary grooves 13 which introduce atmospheric gas from the primary groove 12 into a window 11f are formed along the window 11f circumferencially so that they pass the primary groove 12 and the lower surrounding side of the window 11f along the tilted surface 11d of the body 11a. Therefore, atmospheric gas is sprayed directly from diversified directions to a semiconductor device 1 and an inner lead 2b at a same flow rate. It is possible in this way to prevent oxidation of bonding area ranging over the whole area of the window and to conduct stable bonding. |
