| 摘要 |
PURPOSE:To improve the accuracy in punching and to reduce the cost by providing the light projection part having a semiconductor laser at either one part of a punch or die and arranging the light receiving part equipped with a position detecting device at the other part. CONSTITUTION:The light receiving part 18 of a position detecting sensor is provided on a punch part 12, the light projection part 19 of the position detecting sensor is arranged at a die part 13 and the position detecting sensor is composed of the light projection part 19 and light receiving part 18. The laser light projected from a semiconductor laser 20 is led into the light receiving part 18 via a light projection lens 21. The light receiving part 18 focuses a light image on a position detection device 22 via a light receiving lens 23 and the work current proportionate to the position of the light image is passed. The displacement of the punch 12 and die 13 is detected via this work current and a driving system executes a feedback control. Since the displacement of the punch 12 and die 13 is completely prevented, the punch working accuracy is thus improved and the cost is reduced. |
