| 摘要 |
PURPOSE:To enable lowering the baking temperature of a dielectric material by containing the specific amounts respectively of TeO2, Li2O, B2O3, SiO2 and RO where R stands for at least one or more of Ba, Ca and Sr. CONSTITUTION:0.5 TO 40mol% of TeO2, 1 to 20 mol% of Li2O, 10 to 40mol% of B2O3, 10 to 50mol% of SiO2 and 20 to 70mol% of RO are contained, provided that R stands for at least one or more of Ba, Ca and Sr. According to the aforesaid composition, the baking temperature of a dielectric porcelain material can be lowered and in this case, the baked dielectric porcelain is not adversely influenced in the dielectric loss thereof. |
