| 摘要 |
<p>PURPOSE: To manufacture a printed circuit board comprising high thermal stability and superior electric property and rigidity, by combining at least one layer of a specific rigid polyurethane modified polyisocyanurate thermosetting composition and at least one layer of a material selected from metal, cellulose, plastic, glass and ceramic or combinations thereof, and compressing and molding the same. CONSTITUTION: A rigid polyurethane modified polyisocyanurate thermosetting composition is prepared by reacting a reaction mixture of organic di- or polyisocyanurate, about 2-50 (preferably 10-25) pt.wt. of cyclic alkylene carbonate and about 2-50 (preferably about 10-25) pt.wt. of polyether polyol (pt. wt is on the basis of the total isocyanate-carbonate-polyol mixture) in the presence of the soluble adduct of tertiary amine and cyclic alkylene carbonate as a catalyst of about 0.005-5.0, preferably 0.008-1.0 wt.% of concentration on the basis of the total composition, in a compression mold at a temperature from the outside temperature to about 140 deg.C.</p> |
