| 摘要 |
PURPOSE:To make a mounted TAB semiconductor device stable in an operational property by a method wherein a required potential is applied to the substrate of the TAB semiconductor device mounted on a primary face of a circuit substrate through the intermediary of a metal thin plate fixed to the other primary face of the circuit substrate. CONSTITUTION:A required circuit pattern and a through-hole 14 corresponding to a TAB semiconductor device 12 are provided onto a primary face of a printed substrate 11, and a metal plate 15 is fixed to the other primary face. The TAB semiconductor 12 is placed in the through-hole 14, whose base is covered with the metal thin film 15, making its face upward and connected with metal thin film 15. Following this structure, the TAB semiconductor device mounted on the circuit substrate 11 is made operationally stable by applying a power potential or a ground potential to the metal thin plate 15. |
