| 摘要 |
PURPOSE:To avoid a carrier from being damaged, even if a workpiece is grinding-worked at a high speed by forming each fiber-reinforced resin layer on the upper and lower surfaces of a steel plate arranged at the center part of the carrier for holding the workpiece whose both surfaces are to be ground. CONSTITUTION:A workpiece (e.g., IC substrate, wafer for electronic part) 4 held in a holding hole 15 on a carrier 1 is fed between the rotary grinding wheel 20 and 30 in pairs by revolving the carrier 1, and the both surface of the workpiece 4 are ground at the same time by the grinding wheel 20 and 30 which revolve in the reverse directions. In this case, a hard stainless steel plate 10 is installed at the center part of the carrier 1, and a fiber-reinforced resin layer 11 impregnated with the epoxy resin which is soft and abrasionproof is formed on the upper and lower surfaces of the stainless steel plate 10. Therefore, even if the workpiece 4 slides during the grinding work in the holding hole 15, the abrasion of the resin layer 11 is suppressed by the stainless steel plate 10, and the shape of the holding hole 15 on the carrier 1 is maintained constant for a long period, and the life of the carrier 1 is prolonged, and the carrier 1 which can sufficiently endure the high speed grinding can be obtained. |
