| 摘要 |
PURPOSE:To make it possible to mount a many types of chip components at high speed, to decrease a size of the total structure and to simplify the construction, by providing a plurality of tape unit mounting sections, a conveying section, a reversal section and a mounting head. CONSTITUTION:Tape units 2-1-2-n loaded with tapes 3 receiving a multiplicity of chip components 5 are selectively driven such that chip components 5 as desired are fed upside down to a conveying section 8 in an order as desired. The conveying section 8 conveys the chip components 8 sequentially to a position 18a for transferring them to a reversal section 15. In the reversal position 15, the chip components 5 are turned such that they take normal position with the surfaces on the upside. The chip components 5 are then conveyed to a position 18b for transferring them to a mounting head 20. Accordingly, there is no need of shifting the tape units 2-1-2-n to the mounting head 20. This fact makes it possible to decrease the size of a mounting apparatus and to improve a mounting speed. |
