发明名称 ULTRASOUND PROBE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To bond the individual vibration elements and a wiring sheet firmly, in an ultrasound probe.SOLUTION: A contact area 58 in a wiring sheet 12 has a conductive layer, where an exposure hole group 70 is formed. Individual exposure holes 40 expose a base layer. When each vibration element is bonded to each bonding surface 66, an adhesive enters into individual exposure holes 40. Consequently, the base layer is bonded directly to the lower surface of the individual vibration element, without interposing the conductive layer. A plurality of exposure grooves may be formed in place of the exposure hole group 70.SELECTED DRAWING: Figure 2
申请公布号 JP2016152580(A) 申请公布日期 2016.08.22
申请号 JP20150030421 申请日期 2015.02.19
申请人 HITACHI LTD 发明人 TAN SATOAKI;HIRUKAWA MORIYUKI;YAMAGUCHI KENTA
分类号 H04R17/00;A61B8/00;H01L41/047;H01L41/09;H01L41/113 主分类号 H04R17/00
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