| 摘要 |
<p>Multilayer printed circuit boards having a number of through-holes are formed using intermediate layers in bonding copper circuitry to an insulating layer. These intermediate layers comprise a layer of copper oxide or hydroxide or combination thereof, or a layer of a less noble multivalent metal (e.g. tin) with a layer of its oxide or hydroxide or combination thereof, and an organosilane layer.</p> |
