| 摘要 |
PURPOSE:To reduce a substrate face to be mounted with a package IC by disposing electrode plate having common electrode characteristic in the elevational direction of a mold from the side face of the mold. CONSTITUTION:The electrode terminal and electrode plates 2, 3 of an IC chip 5 are formed of the same material in a mold 1, but branched in two directions immediately before they protrude from the mold 1. Thus, the plate 2 of the plates 2, 3 is bent on the face of the mold toward the upper face of the mold after protruding from the mold 1, protrudes from the upper face, and is bent in parallel with respect to the upper face of the mold in a horizontal U shape. The plate 3 is bent at the side of the mold toward the lower face of the mold, protrudes toward its lower face, and bent in parallel with the lower face of the mold in a horizontal U shape. Paired electrode plates 2'-, 3'- are similar. Thus, the substrate surface to be mounted with a package IC can be reduced, thereby rationalizing a mounting structure. |
