发明名称 ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE TRANSFER TAPE
摘要 The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.
申请公布号 HK24989(A) 申请公布日期 1989.03.31
申请号 HK19890000249 申请日期 1989.03.23
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 REYLEK, ROBERT S.;THOMPSON, KENNETH C.
分类号 C09J7/02;H01L21/301;H01L21/302;H01L21/58;H01L21/683;H01L23/373;H01L23/482;H05K3/32 主分类号 C09J7/02
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