| 摘要 |
<p>PURPOSE:To reduce stress applied to a terminal for a semiconductor element, and to remove heat generated from a semiconductor effectively by a method wherein a pad forming surface for external connection of the semiconductor element is arranged upward, the pad and a flexible printed circuit are soldered by a beam heat source from an upper section, the underside of the semiconductor element is joined with a cooling body and heat is absorbed by the cooling body. CONSTITUTION:A pad forming surface for external connection in a semiconductor element 1 is disposed upward, that is, in a face-up manner, and the semiconductor element 1 is insulated electrically from a metallic cooling body 7 through an adhesive layer 2, and joined so that the conduction of heat is improved. The metallic cooling body 7 is composed of a metal having superior heat conduction, cooling holes 8 are formed into the metallic cooling body 7 by using a metallic joining method, and a refrigerant is flowed into the cooling holes 8 and the metallic cooling body is cooled. Pads for external connection for the semiconductor element 1 and multilayer interconnections 10 are soldered by semiconductor element terminals 3 and multilayer interconnection terminals 5 through flexible printed circuits 4. Accordingly, a joining section having high reliability is acquired.</p> |
