发明名称 METHOD OF FORMING A METALLIC SILICIDE
摘要 <p>A method of forming a metallic silicide on silicon or polysilicon in which a masking layer such as silicon dioxide is formed on a silicon slice and patterned to expose selected areas of the slice surface. The slice is then sputter etched followed by in situ deposition of a metal layer. The slice is heated to convert the portion of the metal layer in contact with the silicon and/or polysilicon to a metal silicide, then the non-converted metal is removed by a selective etchant. According to another embodiment of the invention a titanium layer is deposited and reacted in an ambient including nitrogen to prevent the out-diffusion of silicon through the TiSi2 and titanium layers.</p>
申请公布号 EP0128304(B1) 申请公布日期 1989.03.29
申请号 EP19840104198 申请日期 1984.04.13
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 LAU, CHI KWAN
分类号 C23C14/02;C23C14/06;C23C14/58;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;(IPC1-7):H01L21/285 主分类号 C23C14/02
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