| 摘要 |
PURPOSE:To enable continuous working by facilitating the molding with epoxy resin and contrive to improve the quality and reliability by a method wherein the epoxy resin containing organo dibasic acid dihydrazide and imidazole compound and having epoxy radical in the molecule is used as the sealing layer, after covering a semiconductor pellet with polyimide silicone resin. CONSTITUTION:A surface stabilizing material 10 is composed of polyimide silicone resin, and the sealing layer 11 contains 3-15mols of organo dibasic acid hydrazide to 100mols of epoxy resin, and 2-7mols of imidazole compound in the molecule. The polymide Si resin is excellent in adhesion property with epoxy resin and semiconductor. When the epoxy resin is dripped to a rotating sub assembly, said resin gets the viscosity decreased owing to the thixotropy thereof, thus becoming wet to a header lead 4 and said material 10. On the other hand, the resin does not accur the thixotropical change at a part distant from the sub assembly, but keeps the shape shown in the figure. Heating only the surface part of the epoxy resin causes said resin inside to be in an enclosed form by the hardened surface part. Finally, when said resin inside is hardened by heating, a resin molded type diode having the sealing layer 11 can be obtained. |
