发明名称 METHOD AND DEVICE FOR HANDLING ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To handle an extremely thin electronic part smoothly without being damaged by mechanically lowering a collet once up to where the nose of the collet is not brought into contact with the top face of the electronic part, releasing air floating and bringing down the nose of the collet up to the top face of the electronic part. CONSTITUTION:When a collet holder 20 is floated previously by an air floating mechanism and an electronic part to be sucked 62 is sucked, said collet holder 20 is taken down mechanically up to where a distance up to the top face of the electronic part from the nose of a collet reaches a floating distance or less, air floating is released, and the nose of the collet is lowered up to the top face of the electronic part. The nose of the collet is brought into contact positively with the top face of the electronic part at that time, but a hover effect works, thus preventing the damaging of the surface of the electronic part due to the falling of the nose of the collet. Accordingly, an electronic-part handling system, in which impact load at the time of the contact of the nose of the collet and the electronic part is minimized by a simple mechanism, and a device by said system are acquired.</p>
申请公布号 JPS6482542(A) 申请公布日期 1989.03.28
申请号 JP19870240409 申请日期 1987.09.25
申请人 HITACHI ELECTRON ENG CO LTD 发明人 TSUCHIYA KEIZO;NISHIMURA SADATOMO;IKUMI MASUZO;YOSHIZAKI ZENYA
分类号 H01L21/677;H01L21/68 主分类号 H01L21/677
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