| 摘要 |
PURPOSE: To improve the productivity by a method wherein a pair of stair boards whose thickness of both plastic fabricated edges is greater than that of the central section are assembled at right angle direction and the entire part of ridge-line section is connected, the inner part thereof being formed into a hollow rectangular parallelepiped. CONSTITUTION: A pair of sectional rectangular stair boards 11 and 12 whose thickness T2 and T4 of both edges are greater than thickness T1 and T3 of the central section are formed by a plastic fabrication method considering the functions required for manufacture of IC card such as bending, rigidity against impingement, punching and welding characteristics, etc. Thereafter, both stair boards 11 and 12 are assembled at right angle direction and the entire part of a ridge-line section 13 is connected by welding which results in making a hollow rectangular parallelepiped to form IC container 10. High yield rate and productivity can be obtained by this method. |
