| 摘要 |
PURPOSE: To prevent application of high stress to a surface of an IC chip and the generation of large distortion on a bonding wire when the rigidity of a substrate is increased to a peripheral part and the temperature difference is generated on the module, by extending a die pad comprising a metallic layer such as Cu, Ni, Au or the like to the rim of the module. CONSTITUTION: In a module 9 for an IC card where an IC chip 5 is sealed by a sealing resin 8 by the potting or transfer mold, a die pad 3 comprising a metallic layer such as Cu, Ni, Au or the like is extended to the rim of the module 9. The die pad 3 is insulated from a bonding terminal 4 by a groove formed around the bonding terminal 4. By extending the die pad 3 to the rim, the rigidity of a substrate 1 is increased on the rim, which relieves the stress added to an edge part of the IC chip and the distorsion added to an AU wire 6, whereby the faulty connection of the bonding wire, the increase of the resistance value and the disconnection can be prevented and the reliability can be improved. |
