| 摘要 |
PURPOSE:To prevent cracks from occurring in a ceramic package by fixing a plurality of molybdenum plates to a region having an area larger than the semiconductor element where the semiconductor element is to be mounted. CONSTITUTION:A ceramic semiconductor device is fabricated using a ceramic package 11. At that time, a plurality of molybdenum plates 13 are fixed to a region having an area larger than a semiconductor element 12 where the element 12 is to be mounted. Whereupon, the area of the package 11 fixed to one molybdenum plate 13 becomes small. The stress on the pacakge 11 is reduced even for a rapid heating. With this, cracks are prevented from occurring in the package 11.
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