| 摘要 |
<p>PURPOSE:To improve solderability even when electrode leading-out section itself is used for connection with the outside by forming an electrode leading out section on the end face of a film capacitor element and smoothing the surface of the electrode leading out section. CONSTITUTION:Electrode leading-out sections 6, 7 are composed of first layers 6a, 7a, on which a copper-zinc alloy is flame-sprayed, and second layers 6b, 7b on which solder is flame-sprayed. The surfaces of the layers 6b, 7b in the electrode leading-out sections 6, 7 are shaped to smooth surfaces through polishing by an end mill and sand paper. A chip capacitor 15 is arranged onto a printed board 14 with a wiring pattern 13, and the electrode leading-out sections 6, 7 for the chip capacitor 15 are connected to the wiring pattern 13 with solder 16 through the soldering of dipping into a solder bath or soldering by a reflow system. Since the surfaces of the electrode leading-out sections 6, 7 are formed to the smooth surfaces, probability of coating with novel solder of the electrode leading-out sections 6, 7 is elevated to 90% or above, thus improving solderability.</p> |
