发明名称 METHOD FOR REPLENISHING COPPER TO CHEMICAL COPPER PLATING LIQUID
摘要 PURPOSE:To enable the selective replenishment of only the consumed copper ions by partitioning the inside of an electrodialysis cell to a cathode chamber, intermediate chamber and anode chamber and administering the concn. of the hydrogen ions in an aq. copper compd. soln. for replenishment introduced into the anode chamber. CONSTITUTION:The inside of the electrodialysis cell 10 is partitioned to the cathode chamber 30, the intermediate chamber 40 and the anode chamber 50 by disposing an anion exchange resin film 20a and a cation exchange resin film 20b. A chemical copper plating liquid 13 is put into the intermediate chamber 40 and is circulated between said chamber and plating chamber. The aq. soln. 12 of the copper compd. to be replenished to the plating liquid is introduced into the anode chamber 50. Dialysis is executed by impressed a DC voltage between a cathode electrode 1 and an anode electrode 2. While the concn. of the hydrogen ions in the aq. copper compd. soln. 12 in the anode chamber 50 is administered to a specified range, the copper ions consumed by the chemical plating reaction are selectively replenished. Only the copper ions are thereby selectively replenished into the plating bath without accumulating the counter anion of the copper ions into said bath.
申请公布号 JPS6475682(A) 申请公布日期 1989.03.22
申请号 JP19870232301 申请日期 1987.09.18
申请人 NEC CORP 发明人 OTA HIROTOKU
分类号 C23C18/40;C23C18/16 主分类号 C23C18/40
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