SEMICONDUCTOR DEVICE COMPRISING AN INSULATING WIRING SUBSTRATE AND METHOD OF MANUFACTURING IT

摘要

A semiconductor device has an IC chip (4) mounted in a hole (3) in a tape carrier substrate (1). The terminals of the IC chip (4) are bonded to some of the leads (8,9) of the wiring pattern on the substrate(s), which leads (8,9) extend into the hole (3). Barrier portions (11), being formed from wide parts of the leads (8,9) and other parts of the wiring substantially surround the hole (3) with a predetermined spacing (G1) therefrom. The barrier portions (11) limit the flow during heat treatment of protective resin material which is applied to cover the IC chip (3) and adjacent parts of the substrate (1). By limiting that flow, before coagulation of the resin, the layer of protective material may be made flat.