| 摘要 |
In an image reversal process (12), a photoresist coating on a wafer is baked in an oven (19) in the presence of amine gas to fix the exposed photoresist portion (14). A computer (21) is programmed with a characterization of the photoresist film. The output of a temperature sensing element (23) mounted on the wafer is directed to the computer which, in response, controls introduction of the amine gas and withdrawal of the wafer after a predetermined extent of reaction in the coating.
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