| 发明名称 |
POLYAMIDE RESIN COMPOSITION EXCELLENT IN PLATE ADHESION |
| 摘要 |
A polyamide resin composition excellent in plate adhesion which comprises 35% to 90% by weight of a polyamide resin, 5% to 60% by weight of an inorganic fiber and 5% to 50% by weight of wollastonite. |
| 申请公布号 |
DE3476672(D1) |
申请公布日期 |
1989.03.16 |
| 申请号 |
DE19843476672 |
申请日期 |
1984.06.28 |
| 申请人 |
MITSUBISHI RAYON CO. LTD. |
发明人 |
SHIGEMITSU, HIDEYUKI |
| 分类号 |
C08K3/34;C08K7/04;C08K13/04;C08L77/00 |
主分类号 |
C08K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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