| 摘要 |
PURPOSE:To prevent the corrosion of a bonding pad generated from quality, in which moisture absorbed by a sheathing resin reaches to the peripheral section of a semiconductor substrate first, by forming the bonding pad near the central section of the rear of the semiconductor substrate. CONSTITUTION:A plurality of bonding pads 2 for external connection are shaped near the central section of the rear side on the side reverse to the main surface of a semiconductor substrate 1. A plurality of aluminum through-holes 3 connected to electrodes for an electric circuit section 11 are formed to the edge section of the semiconductor substrate 1 in the outer circumference of the electric circuit section 11. The bonding pads 2 and the through-holes 3 are connected by aluminum wirings 4. The bonding pads 2 are exposed, and the main surface and rear of the semiconductor substrate 1 are coated with cover films 6 as insulating films. The semiconductor substrate 1 is loaded to a mounting section 7 for a lead frame 8 while the main surface side of the semiconductor substrate 1 is directed downward, and the bonding pads 2 and leads 10 are connected by bonding wires 5. A sheathing resin 12 is formed, covering the whole semiconductor integrated circuit under the state in which the nose sections of the leads 10 are exposed. |
