| 摘要 |
PCT No. PCT/SE88/00336 Sec. 371 Date Dec. 18, 1989 Sec. 102(e) Date Dec. 18, 1989 PCT Filed Jun. 17, 1988 PCT Pub. No. WO89/00374 PCT Pub. Date Jan. 12, 1989.A method for manufacturing a circuit board on which electronic components and electrical circuits are to be mounted and connected together. The method comprises positioning mutually insulated and mutually intersecting electrical conductors in a layer of substrate material, preferably to form an x/y matrix, and treating the substrate material, with the conductors embedded therein, in a manner to establish interruptions in the various conductor paths at given locations therein, and to establish permanent electrical contact between the intersecting conductor paths at given locations of intersection. The substrate material used is sensitive to a given kind of radiation, and the material is irradiated, while screening those locations at which interruptions are to be established or at which the conductor paths are to be connected together. The material in the non-irradiated locations is then chemically removed, in order to expose the conductors at these locations, whereupon the exposed conductor paths are severed by etching at those locations where interruptions are desired and the conductor paths are mutually connected at the intersection locations where electrical contact is desired, by soldering or metal plating techniques. The invention also relates to a preform for use in manufacturing a circuit board in accordance with the method. |
