| 摘要 |
PURPOSE: To prevent IC device from falling off and to enable its manufacture in a simplified process by directly mounting IC device on the mounting portion formed on the card substrate itself. CONSTITUTION: IC card substrate 1 formed with IC device mounting hollow 1a is fabricated with injection mold of PES resin 9 under temperature conditions of metal molds 6 and 7 at 150 deg.C and cylinder 8 at 370 deg.C. Then through holes are drilled, followed by preparation of electrode terminal 3 on the front surface of the card substrate 1 and conducting circuit 2 on the back face using semi- additive system. Further, 1C device 4 is dye-bonded and wire-bonded on the IC mounting hollow la of the IC card substrate 1. Then the IC mounting hollow 1a is sealed with epoxy resin and printed labels 5 are stuck on both sides of the card substrate 1 to produce the IC card monolithic with the substrate. Obtained with this procedure is the IC card with good bending characteristics and excellent heat resistance. |
