| 摘要 |
PURPOSE:To prevent resin crack generating at the time of temperature cycle testing and surface mounting, by bending downward the outer peripheral end- portion of a lead frame tab in the manner in which the tip of the bent part reaches the inner side of the end-portion of semiconductor element mounting part of the tab. CONSTITUTION:A lead frame for semiconductor device is provided with an integrated body of a tab 2 for mounting a semiconductor element 1, and leads 3. Outer peripheral end-portions of the tab 2 are bent downward in the manner in which the tip 9a of the bent part 9 reaches the inner side of the end-portion 2c of a semiconductor element mounting part 11 of the tab 2. The bent part 9 formed on the outer peripheral part of the tab 2 can be arranged on not only two sides parallel to the lead 3 but also four sides of the tab. As a result, the bent part 9 cuts into resin 5, and mechanical coupling force increases. The contact area with resin 5 also increases, so that boundary bonding force increases. Therefore strong coupling between the tab 2 and resin 5 can be obtained, and the generation of exfoliation on a bonding surface can be prevented. |
