| 摘要 |
PURPOSE:To obtain an electronic component having a conductive layer composed of tin or platinum containing tin which is capable of solid connection to an external electric circuit and the like, even if thermal hysteresis like burn-in test or the like is applied, by stacking and fixing two or more metal layers composed of the respective specific nickel layers as the base of a conductive layer composed of tin or platinum containing tin. CONSTITUTION:The title electronic component has a conductive layer 6 composed of tin or platinum containing tin, on a metal surface 3 arranged on the surface of an insulative substrate 1. As the base of the conductive layer 6 composed of tin or platinum containing tin, a metal layer is stacked and fixed which is composed of at least the following two layers; a first nickel layer 4 whose cobalt content is less than to equal to 3.0wt.%, and a second nickel layer 5 of 0.3-2.0mum thick whose cobalt content is 5.0-30.0wt.%. For example, an external lead terminal 3 is joined to metallized metal 2 on the side surface of the insulative substrate 1 of a semiconductor element accommodating package, via eutectic silver solder. On the surface of the external lead 3, the above- mentioned first and second nickel layers 4, 5 and the conductive layer 6 composed of tin or platinum containing tin are stacked and fixed. |
