| 摘要 |
<p>PURPOSE: To prevent other parts of a wafer from touching a handler, thereby preventing the handler from damaging a wafer by manipulating the wafer, using a specified handler having vacuum and pressure ports. CONSTITUTION: A handler 100 has a wide surface 112, bump 110 formed high with respect to the surface 112, at least vacuum ports 105, 106 disposed near the bump, a vacuum space formed inside the surface 112 through the ports 105, 106 to attract the marginal edge of a wafer 113 to the bump 110, and at least one pressure port 109 disposed inside the surface 112 so as to have a pressurized fluid flow through the port 109, so as to separate the wafer 113 from contacting the surface 112, thus handling the wafer 113. The surface 112 of the hander has, e.g., an area smaller than 1/4 the surface area of the wafer 113.</p> |
