发明名称 |
Integrated semiconductor circuit with decoupled D.C. wiring. |
摘要 |
<p>An integrated semiconductor circuit, in which the D.C. part of the wiring (5) only containing D.C. information lies on a part (2A) of the insulating layer (2) located on the surface which is considerably thinner than the parts (2B) of the insulating layer under wiring parts not forming part of the D.C. wiring. Preferably, for this purpose a substrate contact diffusion (4) connected to a reference potential is provided under the D.C. wiring parts. As a result, H.F. interference signals at the D.C. wiring are reduced so that noise and distortion are considerably reduced.</p> |
申请公布号 |
EP0305001(A1) |
申请公布日期 |
1989.03.01 |
申请号 |
EP19880201774 |
申请日期 |
1988.08.18 |
申请人 |
N.V. PHILIPS' GLOEILAMPENFABRIEKEN |
发明人 |
VAN DE GRIFT, ROBERT EMILE JOHAN;VAN DER VEEN, MARTIEN;LINSSEN, ANDRE |
分类号 |
H01L21/768;H01L21/822;H01L23/522;H01L27/04 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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