| 摘要 |
<p>PURPOSE:To correct a position to be aligned by a method wherein, in a semiconductor substrate where an alignment mark used for alignment of a wafer with a reticle has been formed, at least three alignment marks are arranged inside a region on the water to be aligned with the reticle. CONSTITUTION:Four wafer alignment marks 6a, 6b, 6c, 6d are arranged symmetrically; however, it is enough if at least three or more wafer alignment marks are arranged inside one shot on a wafer. The alignment marks refer to the marks with which both a position in X coordinates and a position in Y coordinates can be identified by referring to one mark. Accordingly, if the alignment marks for X coordinates use are separated from those for Y coordinates use, at least three marks are required for X use and for Y use, respectively. It is preferable that a position of the wafer alignment marks is away from the center of a shot from a viewpoint that an error in a reduction magnification and an error in a reticle rotation are measured; the measuring accuracy of the errors is enhanced. In addition, the wafer alignment marks are situated at an edge inside the shot, it becomes easy to manufacture a reticle of a semiconductor device.</p> |
