| 摘要 |
PURPOSE:To provide a substrate for wiring which is superb in adhesion force between copper and resin and in acid resistance and heat resistance by coating triazine thiol chemical compound on the surface of inner layer plate constituting a circuit on copper foil which is not treated or subjected to oxidation. CONSTITUTION:An inner layer plate where circuit was formed on its surface, prepreg, and copper foil are laminated and heated pressing is performed to form a substrate for multilayer printed circuit. In this case, with surface circuit of inner-layer plate, the one formed on non-rough surface copper foil without oxide layer for prepreg side is used and both inner-layer plate and prepreg are one-piece molded through triazine thiol chemical compound formed on the surface of inner-layer plate. The following general expression is used as triazine thiol chemical compound. In this manner, by forming triazine thiol chemical compound layer on the copper foil circuit of inner-layer plate, wetting property with resin is improved, thus resulting in improved adhesion. |
