发明名称 PHOTOCURABLE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING
摘要 PURPOSE:To reduce the unusual deposit of copper among circuits, and to obtain the excellent definition and durability for a plating solution of the titled composition by incorporating a polyfunctional epoxy resin, an oxirane ring contg. compd., and a photosensitive aromatic onium salt in the fundamental composition of the titled composition. CONSTITUTION:The titled composition contains the epoxide resin which has the viscosity of >=150 poise at 25 deg.C and contains at least two glycidyl ether groups directly bound with an aromatic ring in a molecule, the oxirane ring contg. compd. which has >=140 deg.C b.p. and mol.wt. of <=500, the photosensitive aromatic onium salt, a compd. having 2-4 alkoholic hydroxy groups in one molecule, and a talc powder. Thus, the excellent printing characteristics, durability and anti-staining property for the plating solution are obtd., and the linearity of a copper pattern edging part is improved, even after depositing a chemical plating copper.
申请公布号 JPS6454442(A) 申请公布日期 1989.03.01
申请号 JP19870210693 申请日期 1987.08.25
申请人 NIPPON SODA CO LTD;HITACHI LTD 发明人 MORIKAWA TAKAO;HARUTA HIROYUKI;TSUDA HIDEO;KAWAMOTO MINEO;MURAKAMI KANJI
分类号 C08L63/00;C08G59/00;C09D11/00;G03C1/00;G03F7/038;H05K3/00;H05K3/18 主分类号 C08L63/00
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