| 摘要 |
PURPOSE:To reduce wiring resistance and obtain sufficient contact without forming a wide part in a signal wire by electrically connecting a first electric conductor layer and a third electric conductor layer provided thereon through a first and a third contact hole. CONSTITUTION:After a first contact hole 211 which is wider than a first electric conductor layer 191 on the first electric conductor layer 191 at a second insulating layer 20 on a semiconductor substrate 17 is formed and a second insulating layer 231 which is wider than the first contact hole 211 on the second insulating layer 20 and in the first contact hole 211 is formed, a third insulating layer 24 is formed thereon and a second contact hole 251 is formed on the second electric conductor layer 231 at the third insulating layer 24. And the first electric conductor layer 191 and a third electric conductor layer 261 are electrically connected by forming the third electric conductor 261 on the third insulating layer 24 and in the second contact hole 251. Therefore, the contact resistance between the first and the second electric conductor layers and between the second and the third electric conductor layers can be lessened and sufficient contact can be obtained without forming wide width in signal wiring. |
