发明名称 DRY-ETCHING PROCESS
摘要 In a dry etching process for patterning a substrate (2), an etching mask (4) consisting of a chemically deposited oxide, for example Al2O3, is used and the etching is carried out in a fluorine-containing plasma. By this means, etching selectivities of more than 100 are achieved for a substrate (2) of silicon.
申请公布号 DE3567768(D1) 申请公布日期 1989.02.23
申请号 DE19853567768 申请日期 1985.04.23
申请人 BBC BROWN BOVERI AG 发明人 GOBRECHT, JENS, DR.;ROSSINELLI, MARCO, DR.
分类号 C23F4/00;H01L21/3065;H01L21/308;H01L21/316;(IPC1-7):H01L21/308;H01L21/306 主分类号 C23F4/00
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