| 摘要 |
A method of selective plating a component, which method includes contacting upper and lower faces of the component with upper and lower masks, respectively, so that the lower mask exposes a part of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, the plating pressure and the hardness of the material of the upper mask being such that the upper mask is deformed during plating so as at least partially to mask the edge(s) of the exposed part. |
