发明名称 |
Semiconductor chip assembly. |
摘要 |
An integrated circuit assembly includes a plurality of semiconductor chips (10,18,20,22) which are joined mechanically and electrically. The semiconductor chips are formed by the same or different device technology, and can function as different types of elements or circuits. |
申请公布号 |
EP0304263(A2) |
申请公布日期 |
1989.02.22 |
申请号 |
EP19880307567 |
申请日期 |
1988.08.15 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
CORRIGAN, WILFRIED J.;DELL'OCA, CONRAD J. |
分类号 |
H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|