发明名称 |
Chip contacts without oxide discontinuities. |
摘要 |
<p>An integrated circuit chip including a first surface (64) and a higher second surface (68), with an abrupt sidewall step transition (71) therebetween (71), and having a first layer (36) of a first conductive material disposed over the first surface and over the second surface , but terminating on the first surface level in a first end portion which extends up to but does not touch the sidewall. This end portion comprises a conductive material (74) which has been converted to an insulator. A second layer of a second conductive material (40) is disposed on top of the first conductive layer with essentially no conductive material conversion to insulator therein adjacent to the abrupt sidewall transition. In a preferred embodiment, the conductive material is an alloy of aluminum and the end portion is aluminum oxide.</p> |
申请公布号 |
EP0303812(A1) |
申请公布日期 |
1989.02.22 |
申请号 |
EP19880110698 |
申请日期 |
1988.07.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GAJDA, JOSEPH JOHN;SRIKRISHNAN, KRIS VENKATAMAN;TOTTA, PAUL ANTHONY;TRUDEAU, FRANCIS GEORGES |
分类号 |
H01L21/3205;H01L21/60;H01L21/768;H01L23/485;H01L23/522 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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