| 摘要 |
PURPOSE:To inhibit the formation of a dissimilar intermetallic compound extremely, and to obtain strong adhesion by forming double circular structure using an aluminum group metal at the central section of a wire and a gold group metal on an outer circumferential section as component blank materials. CONSTITUTION:A ball 3 contact bonded and joined onto an aluminum pad 4 on an silicon chip through bonding is shaped, and joined with a lead frame 7 plated with gold 6 on the lead side. A gold wire 1 plating an aluminum wire 2 is mixed in the ball 3 on first joining at that time, but the ball section 3 mainly comrises an aluminum component according to a composition ratio, and stronger joining with the aluminum pad 4 is formed. Since the gold section 1 in a wire and the gold plating section 6 in a frame are bonded directly on second joining, strength is not at issue. Accordingly, the adhesion force inhibiting the formation of an intermetallic compound by the joining of dissimilar metals can be increased. |
