发明名称 Molded resin casing of electronic part incorporating flexible board.
摘要 <p>Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.</p>
申请公布号 EP0304112(A2) 申请公布日期 1989.02.22
申请号 EP19880201651 申请日期 1988.07.29
申请人 TEIKOKU TSUSHIN KOGYO CO. LTD. 发明人 YAGI, NOBUYUKI;INAGAKI, JIRO;MORITA, KOZO;KAKU, YASUTOSHI;KIKUCHI, NOBUYUKI KOSUMO SUTEISHON KAMINAGATANI;MIZUNO, SHINJI
分类号 B29C45/14;H01C10/34;H01C10/44;H01C17/02;H01H11/00;H05K5/00 主分类号 B29C45/14
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