发明名称 |
Molded resin casing of electronic part incorporating flexible board. |
摘要 |
<p>Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.</p> |
申请公布号 |
EP0304112(A2) |
申请公布日期 |
1989.02.22 |
申请号 |
EP19880201651 |
申请日期 |
1988.07.29 |
申请人 |
TEIKOKU TSUSHIN KOGYO CO. LTD. |
发明人 |
YAGI, NOBUYUKI;INAGAKI, JIRO;MORITA, KOZO;KAKU, YASUTOSHI;KIKUCHI, NOBUYUKI KOSUMO SUTEISHON KAMINAGATANI;MIZUNO, SHINJI |
分类号 |
B29C45/14;H01C10/34;H01C10/44;H01C17/02;H01H11/00;H05K5/00 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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