| 摘要 |
PURPOSE:To prevent the admixing of air-bubbles by bringing the projected portion of a chucking rubber into contact with a semiconductor wafer, evacuating a space between both the above members and sucking the wafer on the chucking rubber, pressing the booms of a skirt section against a plate in a vacuum atmosphere, and connecting the space in the skirt section to the atmosphere. CONSTITUTION:A skirt section 9 is first directed upward, a wafer 4 is placed on a chucking rubber 3 while holding a wax-layer on it, and a space 6 is evacuated through an evacuation hole 13 to support the wafer 4 while sucking it. Then, a wafer-applying main body 7 is inverted and then placed on a grinding plate 19. Next, the skirt section 9 is evacuated through an evacuation hole 17, and air is introduced from an air-feeding hole 12 into a cylinder section 8 to push a piston 1 upward and press the wafer 4 against the plate 19. During the operation, the inside of the skirt section 9 is kept in vacuum, so that no air-bubble is confined between the wafer 4 and the plate 19. After that, the space 6 is separated from the vacuum source, and connected to the atmosphere, thus the wafer 4 can be flatly applied to the plate. |
