| 摘要 |
PURPOSE:To improve flatness and parallelism of working surface of a work by providing a base plate, a work-fixing plate, a grinding shaft end flange mointed on the lower end of the grinding shaft and situated above the work- fixing plate, and a flexible pressure chamber between the above grinding shaft end flange and the work-fixing plate. CONSTITUTION:After raising a grinding shaft 20, a work (for example, silicon wafer) W is absorbed on a working surface 14a of a work-fixing plate 14. Then, the grinding shaft 20 is lowered to be set so that the work W is contact with the surface of an abrasive cloth 6 on a base plate 4. And, a fluid such as air or water, etc. is forced into a pressure chamber 22 under pressure, a suitable pressure being set. While discharging the abrasive 12 from the pressure chamber 22, the base plate 4 is rotated, and the grinding shaft 20 is simultaneously rotated and oscillated, thus the work W is ground. Thus, since the angular moment of the grinding shaft 20 is transmitted through the pressure chamber 22 to the work-fixing plate 14, uniformly distributed loads are produced on the working surface of the work W, and thus-flatness and parallelism of the working surface are improved. |
