PROCESS FOR MANUFACTURING THICK-FILM ELECTRICAL COMPONENTS

摘要

There is provided an improvement in a process of manufacturing thick-film electrical component by forming a paste suitable for application to a ceramic substrate. In the process, there are included the steps of applying the paste to the substrate by a conventional screen printing technique, drying the printed substrate and firing the substrate and the paste at elevated temperatures to form the electrical component. The improvement disclosed herein comprises firing said paste and substrate composite in a furnace hot zone maintained at a temperature of between 300 and 1000.degree.C under an atmosphere of gaseous nitrogen to which is added from 10 to 10,000 ppm nitrous oxide.